诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。

诸如桥接、不熔湿、反熔湿以及发生焊料结球等缺陷的的可能性可能增加。的英文翻译

基本释义

• Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase.