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- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
- Advanced packaged technique 先进成套技术
- Global Advanced Packaging Technology LTD. 威宇科技测试封装有限公司。
- Advanced Package Tool) is a management system for software packages. 高级包管理工具)是一个软件包的管理系统。
- BGA has been the mainstream of the advanced packaging technology of IC industry. BGA封装是目前高密度电子封装的主流。
- OBJECTIVE To explore the effect of vacuum packaging technique for storing sterilized packs in order to extend the period of valid storing. 目的探讨应用真空包装技术保存无菌包,以延长无菌包保存的有效期。
- KEY JOB DUTIES &RESPONSIBILITIES: 1 Design and develop novel advanced packaging for 10 to 100 gbit optical ass...... ... 公司名称:菲尼萨光电通讯(上海)有限公司工作地点:上海市发布时间:2009-4-10
- L.Heiner, ” Development of Low Loop, Long Length, Hydrostatically Extruded Bonding Wire, ” International Symposium on Advanced Packaging Materials, 1997. 陈信龙,“当分子变成了一条长链-窥探高分子的微观世界”,科学发展,第359期,1999年11月。
- Amenity LLC followed that guideline in creating what the company believes is a superior skin care line in technologically advanced packaging that works for men. 礼仪公司遵循这一准则,创造该公司认为这是上级行的皮肤护理技术先进的包装,作品男子。
- Therefore, it have become important packaging technique of keeping the ultraviolet ray from, and the material is the key, particularly having functions both transparency and anti-UV packaging. 因此,防紫外线包装成为重要的包装技术,而其材料是关键所在,开发既透明又能防止紫外线的包装材料,更具有重要的意义。
- Their products are always attractively packaged. 他们的产品总是包装得非常精美。
- A packaged product containing more than two items. 合装包装有两件以上商品的产品包装
- The technique is still at the experimental stage. 这项技术正处于实验阶段。
- The design of system integrates advanced packaging technology with CPLD ( complex programmable logic device), which is a great breakthrough in micromation and low power and micro-noise. 系统采用CPLD(复杂可编程逻辑器件)与先进球栅阵列封装技术相结合的设计理念,使存储测试系统在微型化、微功耗和微噪声方面有了很大突破,进而拓展了存储测试技术的应用领域。
- He packaged up his old clothes and put them in the cupboard. 他把旧衣服包成一包放在橱里。
- The focus of this sub-project is on the development of miniature millimeter-wave (mmw) multilayer packaging techniques. 本子计画旨在建立毫米波多层构装技术,设计被动元件三维结构,适当结合主动元件,以达到缩小电路尺寸。
- Two methods for analyzing the high frequency effect of the packaging techniques for photodiodes are presented. 摘要推导了封装前后探测器的散射参数的关系,提出了探测器封装网络高频影响的两种分析方法。
- England is an advanced industrial country. 英国是一个发达的工业国家。
- This technique is still in wide use. 这一技术仍被广泛使用。
- The France is one of advanced country. 法国是发达国家之一。