As to electroplated bond, craters formed in front of diamond grits, shallow groove occurred beside diamond grits, and slope bond followed diamond grits.

• 结合剂的磨损为：在金刚石颗粒的前方形成较深的凹坑，两侧形成较浅的凹坑，金刚石磨粒的后面则形成结合剂的隆起。