Based on pointmodel between copper plate and mold powder particle and the adhesion theory between friction and copper plate wear,the wearing extent was analyzed.

• 通过对结晶器铜板与保护渣颗粒微元体接触点模型分析,并结合摩擦与磨损黏附理论分析实际生产中铜板受磨损的影响因素。