Conduct operation including sampling, mounting, polishing, etching, microscope inspection,hardness and mechanical property testing, NDT testing (magnaflux, penetrant, ultrasonic. etc).

• 常规操作包括取样；镶嵌；抛光；腐蚀；显微镜观察；硬度及机械性能测试；无损探伤(磁粉探伤；渗透，超声波等).