Copper Dual Damascene processing for chip metallization, and C4(Flip-chip) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing.

• Cu芯片金属化的双大马士革处理和面阵列芯片封装互连的C4(倒装)技术使电化学技术置于最复杂的制造工艺技术之间。