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- A key problem in chip fabrication is that the new polish method for electromigration and ultra-low K dielectric and Cu electroplating level. 电迁移问题和集成超低k电介质材料与Cu镀层的新抛光方法是芯片制造中的一个关键问题。
- The chemical symbol for copper is "Cu". 铜的化学符号是Cu。
- Cu electroplating 电化学镀铜
- Formation and Growth of Tin Whisker in Lead - free Sn- Cu Electroplated Coating 无铅Sn-Cu电镀层锡须的形成与长大
- Objective: To observe the content of Cu, Fe, Mn, Zn, Cr in urine between electroplating staff and healthy population. 摘要目的：研究分析电镀行业人员与健康人群尿液中铜、铁、锰、锌、铬的含量。
- Wuhan Fengfan Electroplating Technology Co., Ltd. 武汉风帆电镀技术有限公司。
- Is Electroplating Industry in China Descending? 我国电镀工业在滑坡吗？
- Stannous sulphate (for electroplating). 英文标题： Chemical products.
- You may be too cu ing for one,but not for all. 蒙骗得了一人，但蒙骗不了所有的人。
- Sodium stannate (for electroplating). 英文标题： Chemical products.
- F can promote the emission of Pb,Cd,Zn and Cu. 氟会促进Pb,Cd,Zn和Cu的逸放。
- B: Two cu of black coffee, please. 两杯清咖啡，谢谢。
- Most of them are “shi cu” (arrowheads). 其中以石簇的数量最多。
- Cu,Fe and Zn have no obvious relevance to age. 血铜、铁、锌含量不存在显著年龄相关性。
- In this work, we compare the properties of as-deposited Cu films prepared using two different electroplating solutions: copper-hexafluoro-silicate (CuSiF6) and CuSO4. 在此论文中，我们比较两种电解液-硫酸铜及六氟矽化铜，所镀出来铜膜之特性。
- Binders: generally used for metal and electroplating. 结合剂:一般常用金属法及电镀法。
- Liaoning electroplating titanium equipment Co., Ltd. 辽宁电镀钛设备总公司。
- BE USED AS THE ADDITIVE FOR DETERGENT AND ELECTROPLATING IN DUSTRY. 用于洗涤剂,电镀液。
- Electroplating process for the die made of Al is presented. 介绍了铰刀制造过程中，在铝质胎具内孔电镀的工艺过程和部分参数。
