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- Cu are localized risk agents while Cd is the acceptable agent. TSS、DIN、DIP、COD、Cu是区域性的风险因子； Cd是可接受的风险因子。
- CMA optics and coaxial gun arc entirely made of non-magnetic materials and stainless steel Cr16Ni14Mn2. Furthermore, optics and electron multiplier are contained in a mu-metal shield. 整个CMA与同轴电子枪采用无磁不锈钢Cr16Ni14Mn2制造。
- The content of essential metals such as Zn and Cu are higher than unessential metals as Hg,Cd,Pb,Cr,Ni,etc. 蔬菜必需元素锌、铜含量比汞、镉、铅、铬、镍等非必需元素含量高。
- The electrodes materials such as Ni or Cu are widely used for reducing the cost of MLCCs. 广泛地使用金属镍或铜当成电极材料，主要为了较低电容器的价格。
- silicon electron multiplier target vidicon 硅电子倍增靶视像管
- DIN and IP were the major factors for eutrophication, while COD, TPH and Cu were the priority pollutants to be monitoed and controlled in Honghai Bay. DIN和IP是水质富营养化的主要因素 ,而石油类、Cu、COD是重点控制的优先污染物。
- There are electronical storms in your heart. 在你的心中有着电流风暴。
- When a mass of Cu are deposited on ZnO nanowhiskers, Cu_2O and Cu_5Zn_8 are segregated on the center of the ZnO nanowhiskers. 当大量的Cu沉积在ZnO上时,复合纳米粒子呈颗粒状,且由ZnO,Cu5Zn8和Cu2O三相组成。
- Some of the gates were electronically controlled. 一些门是电控的。
- Electron Multiplier of Si Microchannel Plate 硅微通道板电子倍增器
- Al and Cu are ductility materials.Therefore, the value of COF is more than others.And the next is Ti, and the last is Cr film. 而平均摩擦系数之大小排列以，铝材及铜材延性佳之材料最大，钛材次之，镀铬薄膜最小。
- pulse saturated channel electron multiplier 脉冲饱和通道式电子倍增器
- The behaviour of a vermicular cast iron containing trace amounts of B and Cu was investigated and compared with that of a Cr - Mo-Cu cast iron. 本文对含微量硼铜的蠕墨铸铁性能进行试验研究,并与合金铸铁性能对比分析。
- straight parallel channel electron multiplier 直平行通道式电子倍增器
- Tonality depends on the reflected brightness of the terrain and can be electronically measured. 色调依赖于地质体反射的亮度，利用电子设备可以测量出来。
- The dissociative adsorption of hydrogen molecule on (100), (110) and (111) surfaces of Ni, Pd and Cu are investigated using the embeded-atom method (EAM). 用EAM方法(embeded-atom method)研究H_2在Ni;Pd与Cu的(100);(110)与(111)面上的解离吸附.
- parallel plate electron multiplier 平行板电极式电子倍增管
- The static and dynamic stress relaxation characteristics at different temperatures for three kinds of aged Cu Be alloys which were subjected to bending were determined. 测定了 3种铍铜合金带材经时效处理后的静态及动态弯曲应力松弛特性 ,并根据应力松弛行为提出了MAXWELL线弹性粘性体模型 ,建立了剩余应力与时间及温度参数的关系式 ,对静态和动态应力松弛特性进行了计算及预测。
- Unfortunately he won't be here tomorrow evening. 可惜的是他明晚不在这儿。
- After testingthe failure water hat, it was found that Ni, Mo, Cu were insufficient, C exceeded the normal level and hardness was high which resulted in the failure. 对失效水帽进行分析发现 ,材料中Ni、Mo和Cu含量不足 ,而C含量超标以及材料强度、硬度高是失效的重要原因。
