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- Secondly, properties of the diffusion barrier (TaNx) on the Cu/ TaNx/ CoSi2/p+n junctions will be studied by changing the thickness of the diffusion barrier layer and the passivation layer to find the optimum fabrication condition. 其次，本计画第二年将研究铜金属化与矽化钴接触接面之整合，如阻障层厚度之调整以控制阻障特性与阶梯覆盖性之最佳化等研究。
- Ultra-Thin W-Si-N as Diffusion Barrier Layer Between Cu and Si 超薄W-Si-N作为铜与硅之间的扩散阻挡层
- WC DIFFUSION BARRIER LAYER IMPROVES DIAMOND FILM ADHESION TO WC-CO SUBSTRATE 采用WC过渡层增加金刚石薄膜附着力的研究
- Diffusion barrier layer 扩散阻挡层
- A plastic membrane serves as selective diffusion barrier. 一层塑料薄膜起着选择性渗透屏障的作用。
- The results up to now suggest that ZrN layer can be a successful candidate as a diffusion barrier between Si and Cu or Al. 故结果显示氮化锆薄膜可作为铜或铝与矽基版间很好的扩散阻碍层。
- diffusion barrier layers 扩散阻挡层
- The barrier layer eliminates efficiently when each voltage decrement is small.The curre... 本文还探讨了小幅值阶梯降压过程去除阻挡层的原因。
- Zr-Si-N film is a composite that is composed of nanocrystalline-ZrN and amorphous Si3N4.Zr-Si-N film is an excellent diffusion barrier and has good application potential. Zr-Si-N膜由纳米晶ZrN与非晶Si3N4组成双相复合结构，是一种性能优良的扩散阻挡层，具有很大的应用前景。
- If you have sensitive food uses no barrier layer of packaging, it must abandon the mechanism of oxidation drying inks. 如果对敏感的食品使用无阻隔层的包装，那就必须放弃采用油墨氧化干燥的机理。
- In one aspect, the elements contain a hydrophilic substrate, an underlayer, a barrier layer, and a top layer. 一方面，该元件包含亲水基材、底层、阻挡层和顶层。
- Such an increase of indium incorporation is attributed to the pre-strain effect of the low-indium QW on the barrier layer right above it. 铟含量增加的原因是由于低铟量子井对上层的位障层造成拉伸应变，而对接下来成长高铟量子井有更好的晶格匹配。
- Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability. 利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。
- The surface morphology and properties of the thin-films were investigated by four-point probe(FPP)sheet resistance measurement, AFM,SEM,Alpha-step IQ profilers and XRD,also the effects of N and AI doping on diffusion barrier property were discussed. 用四探针电阻测试仪(FPP)、AFM、SEM、Alpha-step IQ台阶仪和XRD等分析测试方法对样品的形貌结构与特性进行了分析表征,并对N和Al的掺杂机理进行了讨论。
- The superiority of HDPE used in barrier layer of landfill was expatiated through the comparison of several manmade composite materials. 通过对几种人工合成材料的比较,阐述了高密度聚乙烯(HDPE)土工膜在生活垃圾填埋场防渗层中应用的优越性。
- The W/Cu functionally graded materials(FGMs) and W/C coatings were made by plasma spraying or heat pressing process, in which W/C coatings have multi-layer W and Re diffusion barrier. 用等离子体喷涂和热压方法制作了W /Cu梯度功能材料和W /C涂层 ,其中W/C涂层具有多层的钨 (W )、铼 (Re)扩散阻挡势垒。
- It is also found that the subsequent etching treatment in a H3PO4 solution can remove the barrier layer on AAO membrane and improve the regularity of holes. 扫描电镜观察显示，氧化铝膜的扩孔过程可以去掉阻碍层，并调节孔径大小，溶去二次氧化后黏附在氧化层表面的一些杂质，从而使氧化铝模板更为规则有序，孔径均一。
- Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit. 以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。
- Nicolet, M.A.(1978). Diffusion Barriers in Thin Films. Thin Solid Films. 52, pp.415. 竹田博光著，赖耿阳编(民83)。陶瓷材料覆膜技术，2-19。台南:复汉出版社。
- Diffusion Barrier of Cu Metallization in ULSI 集成电路Cu金属化中的扩散阻挡层
