Etch rate and selectivity are examined as a function of SF6, flow, O2 flow, CHF3 flow, pressure and the RF power in order to optimize etching condition.

• 为了优化刻蚀条件，将刻蚀速率和选择比表示为SF6、O2、CHF3各自的流最以及气压和射频功率的函数。