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- Eutectic solder joints 共晶焊点
- However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi. 但是，在共晶锡铋焊点中，组成的元素为锡和铋而非单一元素。
- Mei Z,Grivas D,Shine M C,et al.Superplastic creep of eutectic tin-lead solder joints[J].Journal of Electronic Materials,1990,19(11):1273. 闫焉服.;金属颗粒增强锡基复合钎料研究[D]
- Heat solder joints only to the point were solder will flow properly. Excessive heat may distort brass castings. 热焊料连接只能用在焊料能够正确流动的地方。过热可能扭曲黄铜铸件。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives. 改善后的颗粒结构还能够让焊锡结合点的光洁度明显优于传统的无铅合金替代品。
- Q: Will IPC be publishing a new specification for inspection of lead-free solder joints? IPC是否会颁布新的关于无铅焊接的质检标准?
- Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula. 在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。
- It is shown that 96.8 percent of defects inside solder joints are inspec-ted successfully. 结果表明;对盘焊缺陷的检测成功率达96.;8%25。
- Atoms in the solder joints move as a result of both diffusion and electromigration. 另一方面，扩散和电迁移效应，则造成焊点中的原子移动。
- The resulting solder joints have demonstrated improvements in grain structure and have shown a marked increase in reliability. 得到的焊点的晶粒结构得以改善,焊点的可靠性得到了显著提高。
- This flux's finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. 该类型焊剂具有精心研制的活化配系,可以提供现有无挥发性有机物液体助焊剂技术中最佳的熔湿能力和最光亮的焊接点。
- Nitrogen like in the tin-lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen. 与锡-铅系统类似,氮气可以使焊点更为光滑;使用氮气还可以得到更好的熔湿性。
- At solder joints, different materials are brought into contact, and there are compositional gradients at the interfaces. 不同的材料在焊点相互接触，因此在界面处会存在著组成之浓度梯度。
- Keywords tensile strength;quad flat pack（QFP）;eutectic solder; 抗拉强度;方形扁平式封装器件（QFP）;共晶钎料;
- For a high-complexity board with more than 30,000 solder joints, a test strategy of AOI, AXI and ICT before functional test may be most cost-effective. 对于焊点大于30000个的高复杂性印板，在功能测试之前进行AOI、AXI和ICT等测试的方案，会是成本效果最佳的。
- The regression relations between the primary solder joints shape parameters and thermal fatigue life of CCGA are derived through orthogonal experiments and regressions analysis. 通过对CCGA焊点形态参数与热疲劳寿命进行正交回归分析,得出了CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。
- The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。
