It discusses not only a kind of new Vacuum Jointing Process in IC Packaging but also its theory and background. Besides, it enumerates the remarkable achievements by implementing this process.

• 摘要论述了在集成电路生产中一种新的真空烧结工艺，讨论了它的理论依据及产生背景，并列举了通过实行该工艺所带来的显著成绩。