It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.

• 该器件采用供表面安装的无铅(引脚框是100%25雾锡电镀)6引脚MLP微型引脚框封装,并带有外露散热板以增强散热功能。