Miniature and light weight. Suit for reflow and wave flow solder. Stable electrical capability, high reliability. Low assembly cost, suit for automatic SMT equipment. Superior mechanical and frequency characteristics.

• 体积小、重量轻。适应再流焊与波峰焊。电性能稳定,可靠性高。装配成本低,并与自动装贴设备匹配。机械强度高、高频特性优越。