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- Moving Stiffness Analysis on the Parallel Bonding Mechanism of IC Chip Die IC芯片粘片机并联焊头机构的动刚度分析
- Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die IC芯片粘片机并联焊头机构的静刚度分析
- Dynamics analysis for the parallel bonding mechanism of IC chip die based on power bond graph 基于功率键合图的IC芯片粘片机并联焊头机构的动力学分析
- Interpolating Algorithm and Error Analysis for the Parallel Bonding Mechanism of IC Chip Die IC芯片粘片机并联焊头机构的插补算法及误差分析
- Keywords Parallel bonding mechanism;PVT interpolating rule;Dichotomizing principle;Interpolating algorithm; 并联焊头机构;PVT插补规律;对分式原则;插补算法;
- Parallel bonding mechanism 并联焊头机构
- Based on experimental results, the bonding mechanism of Al and steel by Castex in the bonding stage was studied. 研究表明,在铝钢焊合室存在3个复合阶段:压紧阶段,主要存在压合机制及较弱的铝热机制;
- The characters,bonding mechanism,parameters control in glued laminated timber and final test method of EPI adhesives are introduced. 介绍了木材用EPI胶黏剂的特点、粘接机理、在集成材应用中使用的参数控制以及最终检验方法。
- The temperature and the deforming ratio of rolling play great influence on the bonding.The bonding mechanism comes fr... 轧制温度、轧制压下量等工艺参数对界面结合有较大影响,而轧制速度影响不大;
- In this paper,the possibility of copper direct bonding to aluminum nitride substrate is studied,and the bonding mechanism is investigated by means of SEM and EDX. 研究了铜与氮化铝陶瓷直接键合的可行性,运用扫描电镜(SEM)、电子能谱(EDX)对键合机理作了一定的分析和探讨。
- Taking advantage of advanced SEM and TEM technology and modern TFD theory, explanation to microscope bonding mechanism of cold pressure welding was made. 利用近代界面及表面电子结构理论(改进的TFD理论)和现代先进分析测试技术对冷压焊结合的微观机理进行了分析。
- The scanning electron microscope analyses proves that the bonding mechanism of this process is liquid phase sintering,the change of surface freedom energy is the motivity for sin... 扫描电镜分析证实,此复合粉末体系的激光烧结是基于液相烧结机制,表面自由能的改变是其烧结的原动力。
- The results also show that there are two bonding mechanisms in the bonding process. 同时研究还表明:在轧制复合过程中存在着两种结合机理。
- It has been found that the pyrolytic carbon matrix does not merely bond mechanically with carbon fiber surface,and the interface is not a simple plane yet. 实验发现,由化学气相渗透工艺所获得的热解碳并非仅与碳纤表面进行单一的机械粘合,也不是一个简单平面。
- The railway lines run parallel to the road. 铁路线和那条道路平行。
- A Study on Bonding Mechanism of Wheat Straw Board 麦秸人造板胶合机理的研究
- Her experiences parallel mine in many instances. 她的经历多与我的相似。
- My experience in this matter is parallel to yours. 在这件事情上,我的经验和你的类似。
- The road runs parallel with the railway. 该公路与铁路平行。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。