Sb, Ag, Cu, Pd and Ni films deposited on Si substrates were irradiated with 6 MeV F ions. The Scotch tape test was employed to measure adhesion changes as a function of dose.

• 用6MeV F离子束辐照了淀积在Si单晶基底上的Sb、Ag、Cu、Pd和Ni金属薄膜,并用胶带法对不同辐照剂量的各点进行了增强附着阈剂量的测量。