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- Solder powder is the main component of solder paste,and the quality of paste print mostly depend on the solder powder. 焊锡粉是焊锡膏的主要成分,其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
- The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality. 讨论了电子产品SMT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
- Detergent surfactants act as wetting agents to saturate the solder paste layer that is left on the stencil surface (from solder paste printing operation). 这个单位有一个分开的清洗缸和一个人手冲洗驻地。
- This particular manufacturer chose to implement 3-D solder paste inspection with the goal of eliminating all possible defects stemming from the paste printing process. 该厂商选择实现3-D焊膏检测，目标是排除来自焊膏印刷工艺的全部可能的缺陷。
- How to Improve Quality of Solder Paste Printing 浅谈如何提高焊膏印刷的质量
- High Quality and High Throughput of Solder Paste Printing Parallel 锡膏印刷的高生产量与高质量
- The Process Technology of Solder Paste Printing Stencil 漏印焊膏模版的自制工艺
- Process Improvement for High Quality of Solder Paste Printing 提高焊膏印刷质量的工艺改进
- Mainly the author of this essay elaborates the key role of AOI in SMT production line, andtest technology of soldering paste printing and the significance of quality control. 本文主要论述了自动光学检测(AOI)在SMT生产线的重要作用,以及焊膏印刷的检测技术和质量控制意义。
- The Development of Test Instrument for Solder Paste Print Performance 焊膏印刷性能测试仪器的研制
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- Solder paste printing 焊膏印刷
- Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched. 丝印模板,锡浆网,胶水网
- The use of nitrogen will depend on the solder paste flux chemistry. 是否使用氮气取决于焊锡膏焊剂的化学特性。
- Is the sequence of Solder Paste height measurements defined? 锡膏厚度的测量顺序是否指定?
- While stencil printing is widely used to dispense solder paste, some companies use the technology for depositing SMAs. 模板印刷被广泛应用于焊料涂敷工艺过程中，而一些公司则选择把该技术用于贴片胶（SMA）沉积过程。
- We should judge the adhibit of solder paste before screen printing by automatic machine or by hand. 我们在进行锡膏印刷前应对锡膏进行一定的检测。如果没有专用设备也可以用以下的方法检查一下。
- In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4). 在这个过程，标准印刷技术用来把锡膏直接印刷到硅晶片上。
