Tensile strength test and SEM analysis of the soldered joint fralture were carried out to elucidate the effect of thermal cycling on tensile strength and microstructure of QFP soldered joint.

• 焊点强度试验以及断口SEM分析,初步揭示了热循环对QFP焊点抗拉强度及焊点组织的影响规律。结果表明,裂纹在焊点内侧钎料与焊盘界面处产生。