The consumptive power of the circuit will transfer to heat energy, overfull heat energy affects the quality of the circuit, cost of package and refrigeration will be increased to solve this problem.

• 电路的功耗会全部转化为热能，过多的热量会产生焦耳热效应，加剧硅失效，导致可靠性下降，而快速散热的要求又会导致封装和制冷成本提高。