The failure mechanisms that belong to quality and reliability problems include bad bondings, chip defects, adhesion problems, package defects and glue degradations.

• 在器件本身的质量和可靠性问题方面，具体失效机理有引线键合不良、芯片缺陷（包括沾污、裂片、工艺结构缺陷等）、芯片粘结、管壳缺陷、胶使用不当等；