The initial stress of wafer from the manufacturing process is calculated using process modeling.The effect of the lift-off procedure on warpage is simulated using 2-D and 3-D models, respectively.

• 利用制程模拟使模型具有制程后因热膨胀系数不匹配所造成之应力，并分别以二维及三维模型，分析不同剥离方法对翘曲量之影响。