The metal packaging by anodization is initially des igned, combining with the means of electroless Cu plating some factors were analy zed in the experiments.

• 本文对这种封装的性能特点进行了介绍，结合化学镀铜金属化方法，以所研制的阳极氧化铝样品为基板进行了金属外壳封装的初步设计，并分析了一些影响因素。