The polishing pad is main consumables of the CMP system, the structure and surface roughness of pad have great effects on the material removal rate and surface roughness of wafer.

• 抛光垫是化学机械抛光(CMP)系统中的主要耗材之一，抛光垫的结构和表面粗糙度对CMP过程中的硅片材料去除率和表面粗糙度有很大影响。