The result show that the HEDP-Cu plating bath has same separate and covering power as cyanide copper plating bath,the current efficiency is much batter(is up to 90%),while...

• 实验表明在此工艺条件下,镀液的分散能力与覆盖能力与氰化镀铜相当,电流效率比氰化镀铜高得多,可达90%25以上,镀层结合力良好,基本无脆性,具有代替氰化物镀铜的良好前景。