The results show that the new butt joint approach can obtain smoother butt joint interface and greatly improve the coupling efficiency and slope quantum efficiency of EML chips from 17% to 78% and from 0 03mW/mA to 0 15mW/mA,respectively.

• 实验结果表明 ；这种对接生长方案 ；可以获得光滑的对接界面 ；显著提高了激光器和调制器之间的耦合效率 (从常规的 17%25提高到 78%25 )及EML器件的外量子效率 (从 0 0 3mW /mA提高到 0 15mW /mA) .