The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature.

• 摘要简述了集成电路陶瓷封装内部水汽含量的不稳定性，主要是由粘接材料导电胶在高温下分解释放出的水汽所造成的。