This experiment was deposited piezoelectric thick film which useprinting on the silicon chip and low-temperature sinter, makepiezoelectric thick film and silicon chip structure more denser.

• 摘要本文是将压电厚膜利用网印的方法沉积在矽晶片上，同时使用低温共烧的方式，使得压电厚膜与矽晶片更加的警密结合。