Thus, the thesis is aimed to investigate the effects of electromigration behavior on flip-chip package eutectic Sn-Pb solder bumps reliability under high current density.

• 本论文的研究目的主要在探讨覆晶封装共晶锡铅焊锡凸块在高电流密度作用下电子迁移效应对其可靠度的影响。