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- Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer. 利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
- The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardnes... 本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。
- Effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied. 讨论了乙二醇用量、硝酸银用量、酸性镀铜液(底液)用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。
- A Study of Bright Acid Copper Plating 酸性光亮镀铜工艺的研究
- A Noyel Additive for Bright Acid Copper plating 一种新型酸性光亮镀铜添加剂
- Determination of chloride ions in acid copper plating bath by nephelometry 比浊法测定酸性镀铜液中的氯离子
- Determination of chloride ions in acid copper plating bath by spectroanalysis of resonance light scattering 共振散射光谱法测定酸性镀铜液中的氯离子
- Additives and Brightening Agent for Acidic Copper Plating 新型酸性镀铜添加剂及光亮剂简介
- Determination of trace iron in acid copper plating solution with spectrophotometry 分光光度法测定酸性镀铜液中的微量铁
- STUDY ON THE TECHNOLOGY BRIGHT ACIDIC COPPER PLATING 酸性光亮镀Cu的研究
- Research on mensuration of brightener content for bright acid copper plating by spectrophotometry 分光光度法测定酸铜光亮剂含量研究
- Determination of Bright Acid Copper Plating Additive 2-Tetra Hydrothiazolthione by Ion Selective Electrode Method 离子选择电极法测定酸性光亮镀铜添加剂2-四氢噻唑硫酮
- Keywords spectroanalysis of resonance light scattering;acid copper plating bath;chloride; 共振光散射光谱法;酸性镀铜液;氯离子;
- On the Quality of Raw Materials and Anode Used in Bright Acidic Copper Plating 酸性光亮镀铜的原材料和阳极的质量问题
- Effect of Rare Earth Additive on Anticorrosion of Bright Acidic Copper Plating 稀土添加剂在光亮酸性镀铜中的应用
- Rapid Determination of High Content Ferric Ion in Acidic Copper Plating Bath 酸性镀铜溶液中高量铁的快速测定
- Consecutive Titration of Sulphuric Acid and Cupric Sulphate in Acidic Copper Plating Bath 酸性镀铜液中硫酸和硫酸铜的连续滴定
- Using multi-grade potentiometry to decompose hazardous formic acid in chemical copper plating liquid into CO... 对化学镀铜液中有害的甲酸用多级电位法,使分解为碳酸气与氢。对亚磷酸用过氧化氢氧化为磷酸后呈钙盐去除。
- acid copper plating 酸性镀铜
- Effect of Current Distribution on Coating Thickness of Acidic Copper Plating Cylindrical Articles 电流分布对圆柱件酸性镀铜层厚度的影响
