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- POMERANTZ D I. Anodic bonding[ P] , U. S. Patent , 1968(3) : 278. 卢学刚.;阳极焊工艺及结合机理研究[D]
- In this dissertation, a Twyman-Green interferometer is used to measure silicon surface deformation after anodic bonding. 本文还采用基于相移干涉的泰曼-格林干涉测试系统对键合后硅片的形貌进行了测量。
- To reduce the production costs and simultaneously obtain high production quality, a flexible microassembly system for automated anodic bonding of MEMS sensors is developed. 为了降低生产成本，同时提高传感器的产品质量，研制了柔性自动阳极键合系统。
- Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass. 半导体硅与玻璃的静电键合技术是微电子机械系统(MEMS)的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
- An effective micromachining process is developed to improve the reliability of the metal wire in the multi-sensor and to avoid adhesion between the PYREX glass and silicon mass in the process of anodic bonding. 针对芯片上各电阻间金属引线的可靠性问题和加速度传感器质量块吸附问题提出了有效的改进方法。
- The glass-ceramic in Li2O-Al2O3-SiO2 system including Na2O with TiO2 and ZrO2 as nucleation agents, which was used to anodic bond in MEMS, was p roduced by the way of conventional melt quenching technology and two-step heat-t reatment. 采用传统的熔体冷却方法,研究以TiO2和ZrO2为成核剂,以含Na2O的Li2O-Al2O3-SiO2系统微晶玻璃为基础组成,通过二步法热处理制度制备出符合微电子机械系统静电键合要求的微晶玻璃材料。
- Double Mobile Alkali Ion Model for Anodic Bonding 阳极连接中碱金属双离子迁移模型
- One movable alkali ion model for anodic bonding 阳极连接过程的碱金属单离子迁移模型
- We supply consumables for test and assembly, as well as packaging, semiconductor fabrication related equipments such as lithography mask aligner, anodic bonder, and etc. ACCULEX 消耗品供应的芯片测试和装配，以及包装材料，半导体制造相关设备，如光刻掩模同步，阳极焊机，等你可以指望我们的晶圆制造设备（提，林研究，瓦里安，珀金埃尔默， SVG的）备件。
- Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy 玻璃与可阀合金的电场辅助阳极连接
- A Possible Mechanism for Current Peak during Anodic Bonding 阳极连接电流峰的一种可能机制
- Investigation of the Glass-Ceramics for Anodic Bonding Material 静电键合用微晶玻璃研究
- Investigation of the glass-ceramics used as anodic bonding material 静电键合用微晶玻璃的研究
- Model investigation on characteristic of anodic bonding current 阳极键合电流模型的实验研究
- Keywords anodic bonding;borosilicate glass;silicon;transition area; 阳极键合;硼硅玻璃;硅;过渡区;
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- This glue makes a good firm bond. 这种胶水粘得很结实。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
- The bond that binds the smugglers together is a rope of sand. 把走私犯联接起来的是条沙做的绳子，一碰就碎。
- Common interests formed a bond between us. 共同的利益把我们联系在一起。
