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bright nickel deposit 亮镍镀层
The component data of pearl nickel, bright nickel , acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained . 为了获得电镀的最佳结果,在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
The third ways of making stencil is electroform. Hole forming by the way of nickel deposit onto the copper cathode. 制作模板的第三种工艺是电铸成型。在这个工艺中，镍沉积在铜质的阴极心上以形成开孔。
Electroplated layers with bright nickel and rare earths added-bright nickel were fabricated. 分别制备了亮镍和添加稀土的电镀结合剂镀层。
At the first electroless nickel and then electroplating bright nickel in the tumbler bath was proceeded. 首先,采用化学镀镍;其次,进行滚镀亮镍。
In the early days copper was normally followed by a relatively thin bright nickel layer with conventional chromium topcoat. 早期，涂覆铜层之后，再涂一薄层光亮镍，然后传统的铬层位于最外层。
Investigations were made on the semi-bright nickel plating additive DN-2, bright nickel plating additive BN-3 and the properties of Composite coatings. 研究了新型半光亮镍添加剂DN-2,光亮镍添加剂BN-3及组合镀层的性能,并与美国Udylite公司、M &T公司及英国Canning公司同类产品进行了对比。
The experimental results suggest that the bonding strength of nickel-lanthanum electrodeposits is higher than that of bright nickel. 实验结果，镍-镧镀层与基体的结合强度高于亮镍镀层与基体的结合强度。
The anodic oxidation reactions of butynediol and propiolic alcohol in the bright nickel electroplating were studied using ultraviolet spectrophotometry. 采用紫外分光光度法研究了丁炔二醇和丙炔醇在光亮镀镍过程中的阳极氧化反应,以期进一步认识添加剂在电镀过程中的作用机理。
The process formula of acid bright copper plating,acid bright nickel plating,(silver) plating and various colour gold plating on fresh flowers were presented. 并给出了鲜花上酸性光亮镀铜、酸性光亮镀镍、镀银以及镀各种彩色金的工艺配方。
Spectrophotometric determination of cobalt in bright nickel plating bath was advanced with ammonium thiocyanate as complexing agent and butyl acetate as extracting agent. 以硫氢酸铵络合钴离子,随后用乙酸丁酯进行萃取,利用分光光度法测量光亮镀镍溶液中的钴离子。
Adhesion between nickel deposit and decorative chromium deposit, decorative chromium deposit and hard chromium deposit was impr oved by strike plating, through rational arrangement of anode plate. 合理布置阳极板实现冲击镀以提高装饰铬层与镀镍层，硬铬层与装饰铬层间的密着性。
Causes for defective nickel deposits were discussed and solutions were presented. 探讨了镀镍层常见缺陷的原因并提出了解决方法。
Moreover, it was feasible to reduce the oxidation of the alkynol brighter by choosing active nickel as the anode in the bright nickel electroplating. 选择活性镍作为光亮镀镍阳极，可以减少炔醇类光亮剂的氧化。
An effective way to reduce phosphorus content in electroless nickel deposits is to use appropriate complexing agents. 降低化学镀镍镀层磷含量的主要方法是选择合适的络合剂。
The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed. 探讨了次亚磷酸钠体系化学镀镍沉积机理。
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating . 采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
Proper wetting agent content can accelerate the nickel deposition rate, make the grains finer, and prevent the formation of pinholes obviously. 适量的润湿剂对镀层的沉积具有促进作用，对防止针孔的生成及细化晶粒具有明显的效果。
A bright red welt rose on his arm. 他的手臂上起了明显的条状红肿。
Blackening processes for electroless nickel deposits are reviewed. Factors influencing the shades and properties of the layer are described. 综述了化学镀镍层黑化工艺方法，影响膜层黑度的因素以及黑膜的性能特点。