您要查找的是不是：
- chip package quality 芯片封装质量
- Based on the IBIS model, a simple method was proposed to estimate the simultaneous switching noise (SSN) of the high-speed chip package. 摘要基于BIS模型，提出了一种新颖、简单地估算高速芯片封装结构同步开关噪声(SSN)的方法。
- The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. 摘要微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。
- Toshiba dubs the peripheral chip package the ‘Super Companion Chip’ that includes audio and image interfaces supporting Cell's high data transfer capability. 日本东芝公司配音周边的薄片包装那 '超级朋友薄片' 那包括支援细胞高的数据移动能力的声音和图像接口。
- Relied on the analysis and discussions of many measures for suppressing the SSN of the package, some design guidelines for the high-speed chip package with low SSN were presented. 基于对多种抑制封装结构SSN措施的分析与讨论，给出了低SSN的高速封装结构设计原则。
- For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package. 为避免覆晶封装结构中使用底胶填充之限制，且同时保有良好的可靠性，本文提出无底胶附加限制层覆晶封装结构的新概念。
- The QFN package(Quad Flat No-lead Package),a new and developing technology for chip package,is a small footprint,low profile,surface mount,plastic encapsulated package with leads on the bottom. QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。
- Technology Department shall define the package materials, package method and package quality requirements to ensure customer can identify the product and give the feedback through the description, identifications on the package. 技术部对所有包装进行规范化设计、编制工艺文件,明确包装材料、包装方法、包装质量要求,确保顾客通过包装说明、标识、追踪卡能正确识别使用产品,并反馈信息。
- He is a great guy, a chip off the old block. 他是一位好人，就像他父亲一样。
- The Development of Memory Chip Package Technology 内存芯片封装技术的发展
- Integrated circuit Flip Chip package 集成电路板叩焊晶片
- Sealed Package Quality Assurance 密封包质量保证
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
- Working with other team members to control the packaging quality and avoid any quality issue. Need to work with QC guys if necessary. 生产过程中与团队其它成员协作控制包装质量，避免生产事故的产生。必要时需与QC一起检查包装产品质量。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
- Introduction of the Chip Package Technology 芯片封装技术介绍
- The supplying party must be responsible for the product quality and packaging quality and provide the technical data or samples necessary for inspection. 供方必须对产品的质量和包装质量负责,提供据以验收的必要的技术资料成实样。
- The gay package is only for dandy. 这种鲜艳的包装只是为了美观。
- The goods are to be sent in airtight package. 这批货物应密封包装运送。
