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- copper Foil tension 铜箔张力
- Uses this product goldfoil, copper foil can not discolorment. 使用本产品金箔、铜箔不会变色。
- This company produces copper foil, aluminous foil, gold foil, and silver foil. 本公司专业生产铜箔、铝箔、金箔和银箔。
- Equivalent heat conductivity of PWB is related to the thickness of PWB,the residual ratio of copper foil and the thickness of copper foil. PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关,设计时需考虑相关因素。
- Copper foil tape with acrylic adhesive for specialty EMI/RFI shielding and protection. 铜箔，无导电性压克力胶系，适合用于EMI/RFI遮蔽，可焊锡。
- Then, the thickness of copper foil and strand diameter of Litz wire is discussed to obtain the minimum winding losses. 最后针对最小线损下，探讨铜箔厚度及多股绞线直径之最佳设计尺寸。
- The Yida Copper Foils Manufacturing Co., Ltd. 亿达铜箔制造有限公司。
- When changing Copper Foil spec. (width/ thickness), simply changesthe rollor guider and relevant parts. 铜箔之宽度或厚度变更时;只需更改相关之导轨或配件.
- The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
- Various insulating materials such as electronic shield materials,PVC,film,Mylar,copper foil,aluminum foil,foam,etc. 电子屏蔽材料、PVC、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。
- A copper foil solution is used to bond the glass pieces together, and then the pieces are soldered together firmly. 铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。
- The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
- The ablation process of copper foil with ultrashort laser pulses was simulated by the double-temperature equation(DTE),which was formatted simply. 使用约化后的双温方程(DTE)对超短激光脉冲烧蚀铜薄层的过程进行了数值模拟;
- The ablation processing of copper foil with ultrashort laser pulses was simulated bythe Double-Temperature Equation(DTE), which was formatted simply. 使用约化后的双温方程对超短激光脉冲烧蚀铜薄片的过程进行了数值模拟;
- This article mainly tell the process of electrolysis copper foil surface treatment and changes in Electro-plate layer crystalline forms. 本文阐述电解铜箔表面处理工艺过程与镀层结晶形态的变化。
- Set up in 1955, Yates Foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry. 美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
- The control of tension upon rolling-up in copper foil production 铜箔生产的收卷张力控制
- Qinghai 10,000 tons / year project is electrolytic copper foil by the end of Section Inventec began building in 2007, and projects for a total investment of 753,390,000 yuan. 青海10000吨/年电解铜箔项目是由中科英华于2007年末开始建设的，项目总投资为75339万元。
- An epoxy resin adhesive used to flexible circuit copper laminat (FCCL) was prepared, a single-sided FCCL was made from copper foil and polyimide film and the adhesive. 摘要研究了一种用于单面挠性覆铜箔板的环氧树脂胶粘剂，用该种胶粘剂粘接铜箔和聚酰亚胺薄膜制备出单面挠性覆铜箔板(FCCL)。
- The company set up in 1999, with primers on the stove three, 15 Mill. Copperbelt production specifications, copper foil, copper and so on. Quality to win the trust of customers. 本公司以1999年成立;拥有上引炉子3台;轧机15台.;生产各种规格铜带;铜箔;铜板等
