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- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design. 本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象,再使用工业界常使用的田口式品质设计方法,将填充胶的控制列为品质特性,然后最佳化参数设计。
- Hybrid Approach for Improving the Reliability of Die Bonding Process 改进晶片键合质量可靠性的综合分析方法
- die bonding process 键合工艺
- Are the ambient conditions controlled for the bonding process? 周围是情况吗受约束的为会接程序?
- Figure 2 illustrates the fundamental aspects of a die bond. 图2所示为管芯连接的基本结构。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding. 13.;3节的内容既涉及热压连接工艺本身;也涉及了自动连接的传送带技术。
- In this paper, research results and disadvantages of main bonding process of zircaloy and stainless steel are reviewed. 分析了核反应堆用锆合金与不锈钢主要连接技术的研究结果及存在的问题。
- Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding . 3节的内容既涉及热压连接工艺本身,也涉及了自动连接的传送带技术。
- The results also show that there are two bonding mechanisms in the bonding process. 同时研究还表明:在轧制复合过程中存在着两种结合机理。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- Matthew: Brushing is a actually obviously been epical for him and it's a bonding, part of the bonding process. 马修:很显然,这种梳理对它大有裨益,同时也是我们建立良好关系的一部分。
- The Bonding Process of Mothers to Their Premature Newborns Through Videotape - Liu K. Y. , Chin C. C. , Lo L. H., &Chou, F. H. 母亲透过录影带蕴育其与早产新生儿之依附关系的经验历程-刘冠吟,金继春,骆丽华,周泛澔
- During the dissolution diffusion bonding process, control of the heat is important to improve well cutability, besides using special alloy powder. 在铸件液膜溶解扩散焊修复工艺中,为保证修复部位良好的加工性能,除采用特制的合金粉末材料外,热过程的控制也是重要的因素。
- Fanfiction has further romanticized this by including telepathy or the sharing of memories etc. as part of the bonding process. 同人小说使它更加浪漫化,比如说成心灵感应或记忆共存什么的。这似乎是“联系”的部分表现。
- Being the only Autobot with the superstructure strong enough to withstand the bonding process, Optimus Prime courageously accepted to be outfitted for it. 他是唯一个结构强度上能够承受火焰喷射的汽车人,擎天柱勇敢的接受装备。
- Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. 摘要键合是IC元件生产的重要封装过程或工序,需要在芯片键合机上完成。
- The influencing factors such as surface treatment process of Ti80,adhesives,sulfuration condition,drying treatment were investigated and the optimum bonding process was obtained. 主要探讨了钛合金表面处理、胶粘剂种类、硫化条件、干燥处理几方面对丁腈橡胶与钛合金粘接性能的影响,并给出了最佳粘接硫化工艺。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。