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- Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated. 研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜。
- Electroless copper plating is a non-electrolytic method of deposition from solution. 化学镀铜是指不使用电解方法而从槽液中沉积镀铜。
- Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition. 在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.
- As the results,it was feasible to prepare compact,uniform,and bright Cu coating on the PUF substrate using the developed electroless copper plating process. 本工艺可在PUF表面镀上一层均匀、色泽光亮的金属铜膜,其粒径匀称、排布规整、镀层致密;
- An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent 乙醛酸化学镀铜的电化学研究
- An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating 络合剂和添加剂对化学镀铜影响的电化学研究
- Electroless Copper Plating of Non-Metallic Particles and Its Effects on Strength of Sintered Friction Materials 非金属颗粒镀铜及对烧结摩擦材料强度的影响
- Electroless Copper Plating on Graphite Surface without Activation and Sensitization 石墨表面无敏化及活化的化学镀铜法
- Processing Technology of Electroless Copper Plating on Graphite Powder by Iron Powder and Formaldehyde 铁粉法与甲醛法在石墨粉表面化学镀铜的工艺对比
- The Solution Study of Electroless Copper Plating Using Nontoxic Glyoxylic Acid as Reducing Agent 环保型乙醛酸为还原剂的化学镀铜液的研究进展
- Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation 陶瓷表面无敏化活化法微细化学镀铜
- Microanalysis of the Surface of Polyimide after each Pretreatment before Electroless Copper Plating 聚酰亚胺表面化学沉铜前处理的微观分析
- Keywords carbon fiber;wettability;electroless copper plating;black core;metallization; 碳纤维;润湿性;化学镀铜;“黑心”现象;金属化;
- Technology for Chromium-Free Electroless Copper Plating on Urushiol Formaldehyde Condensation Polymer and Thermal Resistance of the Copper Coating 漆酚甲醛缩聚物无铬化学镀铜
- Keywords acrylonitrile/butadiene/styrene copolymer;surface pretreatment;electroless copper plating;electroplating tinting; （丙烯腈/丁二烯/苯乙烯）共聚物;表面预处理;化学镀铜;电镀着色;
- Keywords Conductive PET fabrics;Epoxide resin;Electromagnetic shielding;Electroless copper plating;Hypophosphite;Surface resistance;Shielding effectiveness; 导电涤纶织物;环氧树脂;电磁屏蔽;化学镀铜;次亚磷酸钠;表面电阻;屏蔽效能;
- Keywords electroless coppery plating activation solution catalyst sol; 化学镀铜;活化液;催化剂;溶胶;
- Conductive Poly(ethylene terephthalate) (PET) fabrics were prepared by electroless copper and nickel plating. 摘要采用化学镀的方法制备镀铜和镍导电涤纶织物。
- The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless. 只有制备出高分散性、粒度小的胶体催化剂,才可以成功实施直接电镀。
