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- The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
- The method of polypyrrole (PPy) films being synthesized on the surface of insulating epoxy molding compound (EMC) electronic packaging materials and the shielding effectiveness of PPy film were studied. 研究了将导电聚吡咯(PPy)薄膜制备在绝缘环氧模塑料(EMC)电子封装材料表面的方法,及导电PPy 薄膜的电磁屏蔽效能。
- TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Aluminum silicon carbide electronic packaging materials AlSiC电子封装材料
- Present Status and Progress in Study of Electronic Packaging Materials 电子封装材料的研究现状及进展
- Electronic Packaging Technology and Polymer-based Composite Packaging Materials 高导热聚合物基复合封装材料及其应用
- Chemical synthesis of high electrical conductivity polypyrrole film on the surface of electronic packaging materials 电子封装材料表面化学制备高导电率聚吡咯薄膜的研究
- Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials 喷射成形电子封装Si-Al合金凝固过程模拟研究
- New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting 新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料
- All wood packaging materials must be crating. 所有木包装材料必须无树皮。
- Tare: the weight of cotton's packaging materials. 皮重:棉花包装材料的重量。
- electronic packaging materials 电子封装材料
- Packaging materials may look beautiful but cause much waste. 包装材料看起来很漂亮，但是造成了许多垃圾。
- Technical knowledge of the packaging materials, printing process. 掌握包装材料、印刷流程的相关技术知识。
- Research Status and Development of High Silicon Aluminium Alloy for Light Weight Electronic Package Materials 高硅铝合金轻质电子封装材料研究现状及进展
- Participate in testing for the projects related to packaging materials. 参加与包装材料有关的项目的测试工作。
- Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
- The ultraviolet ray light can sterilize the packaging material. 机内装有紫外线灯，能对包装材料进行消毒灭菌。
- In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs. 结合电子封装的现状、子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、磷三官能团型、机硅多官能团脂环族环氧树脂。
