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Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed. 指出,减少污染、延长镀液使用寿命、降低成本仍然是化学镀镍面临的一项长期的任务;
flip chip bump 倒装芯片隆起焊盘
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing 一种低成本倒装芯片用印刷凸焊点技术的研究
The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
Bump Fabrication Methods for Flip Chip 倒装芯片凸点制作方法
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
Bump for Flip chip Attach Technology Formed on the PWB 印制板上形成凸块的倒芯片安装技术
Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。
The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill. [摘要]从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。
CTE mismatch between silicon and BT board is so colossal that flip chip need filling underfill to keep the long-term reliability. 因覆晶封装结构中的矽晶片与有机基板间的热膨胀系数差异颇大，故需填充底胶以确保其长时可靠性。
A flip chip type semiconductor device is provided with a semiconductor chip with a plurality of pad electrodes on one surface. 一种芯片倒装型半导体器件，其配备的半导体芯片的表面上有多个焊盘电极。
Compared to its predecessor, the TAL 10000, the TAL 20000 is claimed to ‘provide a quantum jump’ in flip chip assembly technology for RFID inlays. 相比，它的前身，塔尔阿万，塔尔20000宣称是'提供一个量子跳转'在倒装芯片组装技术的RFID嵌体。
The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface. 采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。