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- Clear, low viscosity, one-component, rigid, heat cure epoxy system which exhibits high heat resistance. 透明的低粘度单组分加热固化环氧树脂,坚硬,高抗热性。
- Clear, one-component, flexible, heat cure epoxy system designed for coil impregnation, and potting applications requiring low viscosity and minimal thermal stress. 透明的单组分加热固化环氧,弹性,专为低粘度、最小热压的灌封浇注要求而设计。
- heat cured system 热固化体系
- heat curing system 热硫化法
- Purpose To evaluate the feasibility of chitosan for its bacteriostasis to heat cured polyacrylic resin denture base material. 目的初步探讨应用甲壳胺纤维作为热固化型丙烯酸树脂义齿基托材料抑菌剂的可行性。
- RTV rubber with low modulus (0.22 Mpa) and high elongation (1221%) was prepared by taking 2 and 3 functional amide silane combination as cure system,HO PDMS and powder filler. 以二官能、多官能度酰胺型硅烷作为硫化体系 ,与 10 7胶、粉体填料配合 ,可制得模量低 (0 2 2MPa)、伸长率高 (12 32%25 )的脱酰胺型室温硫化硅橡胶
- A cure system of DCP/TMT was used to vulcanize CO/NBR blends. The influence of mixing ratio on the tensile properties, compression set and oil resistance were studied. 采用过氧化二异丙苯(DCP)/2,4,6三巯基均三嗪(TMT)作为氯醚橡胶(CO)/丁腈橡胶(NBR)共混胶料的硫化体系,研究了胶料配比对其拉伸性能、压缩变形及耐油性能的影响。
- The structure and properties of epoxy resin cured system filled with organic amine modified ultra-fine bentonite were studied by means of TG-DTA,IR,SEM, Martin heat resistance and Daniel flowing point test etc. 采用TG-DTA、IR、SEM、马丁耐热和Daniel流动点测定等方法,研究了有机胺改性超细膨润土与环氧树脂的固化体系的结构及其性能。
- Formaldehyde emission from cured substance of three kinds of low toxic UF resin through different curing system with environment change was studied. 对不同固化体系下三种低毒脲醛树脂固化物随环境变化的甲醛释放量进行了具体研究。
- The system works on the principle that heat rises. 该项装置是按照热力上升的原理运转的。
- Silicone systems can cure by platinum-catalyzed addition cure systems, tin-condensation cure systems, peroxide-cure systems, or oxime-cure systems. 硅树脂体系可以用铂催化加成硫化系统、锡冷凝硫化系统、过氧化物硫化系统或肟硫化系统进行硫化。
- The test results showed that the mechanical properties of TPO cured by sufur curing system and filled with silica were good when the blending ration of PSBR/PE was 60/40. 结果表明,当PSBR/PE共混比为60/40并采用传统硫化体系、白炭黑作补强剂时,TPO综合性能较好。
- Colored heat curing adhesive for bonding, sealing or potting electronic components. 着色处理胶:用于粘合,密封和灌注电子元件。
- At the end,several frostless curing systems were seeked out. 并找出了多个“无喷霜”的硫化体系。
- Therefor the blend curing systems of DCP are adopted. 因此可考虑采用DCP的并用硫化体系。
- We are quipped with all kind of advanced equipments, which include water heating unit; water de-ionizer; filtration, cooling, liquid circulation systems; advanced paint heat cure ovens, etc. 有热水装置，去离子水发生器，超滤装置，冷却装置，直流电源，各种液体循环系统，漆膜固化烘道等辅助设备，为生产线提供工艺配套。整体设备复杂、技术含量高，工艺先进。
- It introduces the appraisal result of metal coagent MZN in NBR curing with high and low sulphur curing system. 介绍金属活性助剂甲基丙烯酸锌（以下简称MZN）在高硫硫化体系，低硫硫化体系，过氧化物（DCP）硫化体系的丁腈橡胶中的鉴定结果。
- Heat curing makes the high water content of CSH gel formed in the initial hydration period transform to the low water content of CSH gel. 热养护能促使水化初期生成的高含水率的CSH向低含水率的CSH变化；
- The effects of oligomer and diluent on the shrinkage of curing system were discussed. 讨论了齐聚物及稀释剂对固化体系收缩率的影响。
- The influence of TCY/sulfur curing system on the properties of ACM was investigated. 研究硫化剂TCY/硫黄并用硫化体系对丙烯酸酯橡胶(ACM)性能的影响。
