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- Prevent stain from boiling by adjusting the hot plate temperature. 调节热板的温度以防止染剂沸腾。
- Hot plate temperature above to 290摄氏度,many applications with temperature rang above 340摄氏度,Heat platens in contact with parts to be welded. 热板温度达到290摄氏度以上,热板仍与工作接触,很多实例都要用约340摄氏度范围温度。
- The hot plate may spoil the varnish on the table. 这只热盘子会损坏桌面的光泽。
- A hot plate will spoil the polish on this table. 热盘子会毁坏桌面的光泽。
- That hot plate will spoil the polish on this table. 那个热盘子会烫坏这张桌子光亮的表面。
- hot plate temperature 热板温度
- Hot plates may spoil the varnish on a table. 烫碟子会损坏桌面的光泽。
- A hot plate can spoil the table's polish. 热盘子会毁桌面的光滑。
- A hot plate will spoil the polishon this table. 热盘子会毁坏桌面的光泽。
- A hot plate will spoil the table's polish. 热盘子会弄坏桌面的光泽。
- A hot plate will spoil the polish of the table. 热盘子会使桌子失去光泽。
- In hot plate design, every two cavities share a heating zone the temperature of which is measured by a thermocouple. 在热板设计中,每两腔共享一个加热区及一个电热偶
- Hot plate with silicon wafer lowered to heating position. 加热板与矽晶圆降低至加热位置。
- Hot plate caused the above-mentioned direct fuse is the news media. 引发上述热点板块的直接导火索都是媒体的新闻报道。
- The hot plate uses the specail ultra fine line-tube technology,can effecively keep the temperature equilibrating and stabilizing. 加热垫采用特殊超精密线管技术,可有效的保证温度的均衡和平定;
- Temperature stabilizator: temperature stabilizer can guarantee that a super to plate temperature of machinrey so as to avoid the press not precise. 温度稳定器:温度稳定器能够保证超霸直接制版机内的温度恒定,防止出现套准不精确的情况。
- The hot plate uses the special ultra fine line-tube technology,can effectively keep the temperature equilibrating and stabilizing. 加热板采用特殊超精密线管技术,可有效的保证温度的均衡和平定;
- In addition, the hot plate was used to measure the gelling time of the resultant thiirane resin at different temperature. 结果证明环氧树脂在环硫化后凝胶时间降至环氧树脂的37%25-85%25(随环氧官能团转化率的增加而增加),固化速率有明显提高。
- On condition that other technological parameters keep unchanged, the higher the heated plate temperature, the longer the heating time, then the deepe... 同时在压焊阶段由于压力的作用被挤出的熔融塑料也越多,因而形成的焊接熔环也越大。
- Hot plate with silicon wafer in initial configuration (before heating). 加热板与矽晶圆在启始状态(加热前)。