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- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为：抗拉强度在600MPa以上，显微硬度大于180HV，导电率大于80%25IACS。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。
- Standard Specification for Integrated Circuit Lead Frame Material 集成电路引线框材料
- Development and Expectation of Copper-based Lead Frame Material Used in Intergrated Circuit 集成电路用铜基引线框架材料的发展与展望
- The Study of Horizontal Continuous Casting Technology for Lead Frame Material KFC 引线框架材料KFC水平连铸工艺研究
- lead frame material 引线框材料
- Application and Commercialization of Copper Alloy Lead Frame Materials for Integrated Circuits 集成电路用铜合金引线框架材料的应用及产业化
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- What frame materials do you like? 您喜欢什么材料的眼镜架?
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- lead frame materials 引线框架材料
- Using urea formaldehyde resin as frame material and KCl powder as active component, a Ag/AgCl solid state electrode was prepared. 制备了以脲醛树脂为框架，以KCl粉末为活性组分的Ag/AgCl固体电极。
- The thoughtway with suspicious everything, be set each set pattern the ground, subjectively beforehand, accept or reject next by this frame material. 凡事多疑的思想方法，是预先地、主观地设置一个个框框，然后按这个框框去取舍材料。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- Compound of collagen-calcium phosphate is one of the most significative frame material using in bone tissue engineering. 摘要胶原-磷酸钙复合物是最有应用前景的骨组织工程框架材料。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀：卷对卷电镀，接触器件电镀，引线框架电镀，电抛光，选择性点镀等
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引线框架电镀层的质量直接影响着钽电容器的可焊性,所以引线框架电镀层质量的测定方法至关重要。
