您要查找的是不是：
- Part 2 : specifications.Specification number 17 : thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board. 印刷电路用基材.;第2部分:规范
- SMPB Sequential Multilayer Printed Board 多层印制板
- Lamination Process of Multilayer Printed Board 多层板压合制程
- flexible multilayer printed board 挠性多层印制板
- flex-rigid multilayer printed board 刚-挠多层印制板
- "flex-rigid multilayer printed board, rigid-flex multilayer printed board" 刚性多层印制板
- Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment 用正交试验法优化挠性多层板层压工艺参数
- Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards 多层印制板金属基底覆以其他金属薄层的技术要求
- Specification for flex-rigid multilayer printed boards with through connections 有贯穿连接的刚挠多层印制板规范
- rigid multilayer printed board 刚性多层印制板
- multilayer printed board 多层印制板
- Printed boards; part 12: specification for mass lamination panels (semi-manufactured multilayer printed boards) 印制电路板。第12部分:大块分层面板(半成品多层印制板)规范
- Specification for Resin Impregnated Fabric (Preimpreg ) for Multilayer Printed Boards 多层印制板树脂灌注纤维(浸渍)的技术要求
- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
- In the multilayer printed circuit boards (PCBs), the through-hole via transitions are always utilized to link the signal traces between different layers. 在多层印刷电路板当中，连通柱结构总是被用来连结位于不同层的传输线。
- Microstrip multilayer printed circuit board 微带板
- multilayer printed circuit board 多层印刷电路板,多层印制板
- Cutting of printed board lead wire welding tip of electrical industry. 用于电子行业印刷电路板引线焊接头的切割。
- DC POWER BUS DECOUPLING ON MULTILAYER PRINTED CIRCUIT BOARD(PCB) 多层印制电路板电源去耦的研究
- multilayer precision printed board 多层精密印制板
