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- PPGA:(Plastic Pin Grid Array Package) 塑料插针矩阵封装电脑常用缩略词(二十)点对点协议
- CPGA: Ceramic Pin Grid Array Package 陶瓷针栅阵列封装一点
- PGA Pin Grid Array Package 针栅阵列封装
- pin grid array package 管脚阵列型管壳
- Metallized Ceramic - Pin Grid Array HPI 金属化陶瓷-接脚栅格阵列
- the PGA132 package-ceramic pin grid array is employed. 采用陶瓷针栅阵列PGA132封装。
- When testing multi-diode devices, such as pin grid arrays or DIP packages, switching is required to connect a single source-measure instrument to each individual diode. 在测试多二极管装置时，例如针栅阵列矩阵或DIP封装器件，需要开关来将源测量仪器连接到每个二极管。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
- Thermal Stress Simulation for Plastic Ball Grid Array Package 塑料球栅阵列封装的热应力模拟
- Adapter-Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment, Blank Detail Specification for 电子设备用针状栅极阵列插孔的适配器载体方形平板组件的详细规范
- Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment, Detail Specification for 电子设备用针状栅极阵列非机械推动挠性载体插孔的详细规范
- Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package 芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测
- Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊点阵列封装需要倒装焊。
- PPGA Plastic Pin Grid Array 塑胶针状矩阵封装
- Flip Chip Pin Grid Array 反转芯片针脚栅格阵列
- Power Plastic Pin Grid Array 功率塑料插脚栅格阵列
- CPGA Ceramic Pin Grid Array 陶瓷针栅阵列矩阵
- PPGA: Plastic Pin Grid array 塑胶针状矩阵封装
- CPGA: Ceramic Pin Grid array 陶瓷针型栅格阵列
- pin grid array 管脚阵列
