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plastic electronic packaging component 电子模塑封器件
Keywords plastic electronic packaging;moisture absorption;moisture diffusion;hygroscopic stress;moisture-induced vapor pressure; 微电子塑料封装;湿气吸收;湿气扩散;湿应力;蒸汽压力;
plastic electronic packaging 微电子塑料封装
Ever fortune plastic electronic products factory. 深圳市恒之达塑胶电子制品厂。
SUZHOU HUARUI PLASTIC ELECTRON CO.LTD. 苏州华瑞塑胶电子有限公司。
Electronic manufacturing consistof semiconductor manufactruing, electronic packaging and assembling. 电子制造包括半导体制造和电子封装与组装。
TIANJIN SHUANGLU ELECTRONICS PACKAGING MATERIAL CO., LTD. 天津市双鹿电子元件包装材料有限责任公司。
The CPC electronic packaging materials have the best integrated properties when annealed under the temperat. 研究了不同退火工艺对轧制复合CPC电子封装材料力学性能、物理性能的影响。
Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. 由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。
A new experimental technique on the CTE measurement of metal composite leads in electronic packaging using laser speckle interferometry was presented. 在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。
This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 这个版本还包括涵盖新课题，如纳米技术，微机电系统，电子封装，全球气候变化，电动和混合动力汽车，生物工程。
The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging. 在电子元件的设计和电子封装的可靠性评估中焊点的热-机械可靠性是一个关键的因素。
It describes the current situation of electronic packaging industry, analyzes the waste in its inner management, shows the detail steps of using 5S activity in the test workshop. 摘要从电子封装企业的生产现状出发，针对企业内部管理存在的问题，提出在测试车间推行"5S"管理活动的具体实施步骤。
Plastic Electronics Co., Ltd.Tianjin Obote (Business Development) warm welcome to visitors from all walks of life, study tours, business negotiations. 天津奥博特塑胶电子有限公司(业务开发)热诚欢迎各界前来参观、考察、洽谈业务。
Plastic Electronics Co., Ltd.Tianjin Obote (Business Development) is a relevant departments by the State approving the registration of enterprises. 天津奥博特塑胶电子有限公司(业务开发)是一家经国家相关部门批准注册的企业。
In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs. 结合电子封装的现状、子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、磷三官能团型、机硅多官能团脂环族环氧树脂。
In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs. 摘要结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求，介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景，其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。
The thermal analysis of MCM in the past is less likely to adopt Non-Fourier model. The analysis course and method in this paper may be used to study the Non-Fourier effect in electronic packaging for reference. 以往多芯片组件的热分析较少采用Non-Fourier导热模型进行分析,本文所采用的分析过程和方法,对电子封装中的Non-Fourier效应问题的研究提供了可借鉴的分析方法。
The method of polypyrrole (PPy) films being synthesized on the surface of insulating epoxy molding compound (EMC) electronic packaging materials and the shielding effectiveness of PPy film were studied. 研究了将导电聚吡咯(PPy)薄膜制备在绝缘环氧模塑料(EMC)电子封装材料表面的方法,及导电PPy 薄膜的电磁屏蔽效能。
International and internal progress in solder joint shape prediction in electronic packaging are overviewed and some unredeemed problems are mentioned as reference for some researchers in the field. 概述了近年来国内外电子封装软钎焊焊点形态预测研究工作的进展及尚未解决的问题，供有关人员参照。