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- Should a nitrogen atmosphere be used in the reflow process? 回流工艺中是否应使用氮气?
- The reflow process relies on the temperature profile setting. 回流过程依赖于温度曲线的设定。
- A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process. 在迴焊过程中;因BGA锡球内孔隙有气体溢出而形成吹孔.
- In the reflow process, this means monitoring the thermal profile of every production board. 在再流工艺控制中,这意味着要对制造的每块板子的热曲线进行监控。
- No-flow underfill materials that cure during the solder reflow process is a relatively new technology. 在精细金属线条的连铸过程中,影响铸件品质的因素很多,所以有必要对不同的操作条件作影响评估。
- In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile. 本文全面的分析了回流焊温度曲线在回流焊工艺中的作用,回流焊工艺的工艺特点、影响回流焊温度曲线的各种因素。
- In order to overcome the misalignment between SIL/SSIL and nano-aperture, a self-alignment technique based on self-modulation by surface tension during thermal reflowing process is proposed. 为了克服对准误差,本研究提出一种自我对准技术,其方法是利用在热回流制程中表面张力所自行产生的自我调整机制。
- It is a leap in the process of cognition. 这是认识过程的一次飞跃。
- A product of a document copying process. 文件复制过程的一种产品。
- The new process extracts oil from shale. 这一新过程可从页岩里提炼出石油。
- The project is not finished but is till in process. 该项工程尚未结束,仍在进行之中。
- Do not inhale the vapor during reflow. 不要吸入回流焊时喷出的蒸气。
- The process of applying and rubbing in an ointment. 涂油使用以及用油膏擦的过程
- Compatible with infrared and vapor phase reflow solder process. 适用于回流焊接工艺。
- The act or process of pushing or thrusting out. 推,掷推出或掷出的行为或过程
- Adapted to the reflow soldering. 适应于回流焊接。
- This part of the assembly process is now fully automated. 装配过程的这一部分现在是全自动的。
- Situation: After reflow process, tin/lead surface will easily occur dewetting. What is the root cause of it? Why? How do you start to 经过再流焊后,锡/铅表面很容易去湿。它的根本原应是什么?为什么?怎样分析调查?怎么尽可能减小?
- Unloading the cargo was a slow process. 卸货的过程很缓慢。
- Suit for reflow and wave flow solder. 适应再流焊与波峰焊。