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- Bond strength is an important parameter for wafer bond. 键合强度是关系到键合好坏的一个重要参数。
- An equipment for vacuum wafer bonding was developed based on the wafer bonding technology. 摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
- Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field. 摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
- Self propagating high temperat ure synthesis(SHS) is a new kind technol ogy for material synthesizing featured w ith the advantages of low energy consum ption,small pollution and simple process . 自蔓延高温合成技术是一种新型的材料合成技术,具有能耗低、污染小和工艺简单等特点。
- Four fundamental manufacturing technologies namely bulk micromachining,surface micromachining,moulding and wafer bonding are introduced for Micro Electro Mechanical System(MEMS). 介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
- Combining the self propagating high temperature synthesis technology (SHS method) and the centrifugal technique,a uniform ceramic layers and metal/ceramic composite pipes can be formed. 采用自蔓延高温合成技术(SHS法)与离心技术相结合,在普通碳素钢管的内壁复合上一层均匀的陶瓷层,制成金属-陶瓷复合管。
- Over coming lattice and orientation mismatch, direct wafer bonding allows fabricating of structures and devices which can 抰 get through hetero-epitaxial growth. 利用键合技术可以集成晶格或晶向失配的材料，制造传统外延生长技术不能制造的结构和器件。
- Self propagating High - temperature Synthesis 自蔓燃高温合成
- self propagating high temperature synthesis 自蔓延高温合成
- Measurements of the Bond Strength for Wafer Bonding 硅片键合强度测试方法的进展
- Timing Test for Picking Up of Wafer Bonding Machine 硅片焊接机拾起硅片时序测定方法
- The Advances in Wafer Bonding and MEMS 晶圆键合技术与微电子机械系统新进展
- Study on Self Propagating High temperature Synthesis (SHS) of AIN 自蔓延高温合成AIN的研究
- wafer bonding and mechanicalthinning 键合减薄
- Keywords Self propagating high temperature synthesis （SHS）;Refractories; 自蔓延高温合成技术;耐火材料;
- TiB and TiC reinforced titanium matrix composites have been produced by non consumable arc melting technology utilizing the self propagation high temperature synthesis reactions between titanium and B 4C, graphite. 利用钛与碳化硼及石墨之间的自蔓燃高温合成反应 ,经非自耗电弧熔炼工艺制备了 Ti B晶须和 Ti C粒子混杂增强的钛基复合材料。
- Development of a Multifunctional Equipment for Vacuum Wafer Bonding 多功能真空键合设备的研制
- Realization of Testing Wafer Bonding Quality with Cold Light Source 冷光源检测晶片键合质量的实现
- Application of wafer bonding in AlGaInP high brightness LED devices 晶片键合在AlGaInP发光二极管中的应用
