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- sil lead frame 单列直插式引线框
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀：卷对卷电镀，接触器件电镀，引线框架电镀，电抛光，选择性点镀等
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引线框架电镀层的质量直接影响着钽电容器的可焊性,所以引线框架电镀层质量的测定方法至关重要。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为：抗拉强度在600MPa以上，显微硬度大于180HV，导电率大于80%25IACS。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。
- The single-sided fish defects of KFC copper alloys applied to lead frame produced by domestic corporation were studied and analyzed by energy spectrum analysis, SEM and metallographic analysis. 对国内某企业采用半连续铸造生产的KFC引线框架带材表面鱼鳞状缺陷进行了分析和研究。
- The traits of progressive die for IC lead frame have been introduced with emphasis on the ironing stage in layout design and stripping micro-adjustment, safety setup of the structure. 介绍了IC引线框架级进冲模的特点并着重讲述了其排样设计中的整形工位和模具结构中的卸料、微调和安全机构,可供精密级进冲模设计参考。
- Be involved in part development in non-metal materials, like shader and LED frame housing etc. 参与非金属材料零部件的开发，如遮光罩、模块等。
- The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation. 自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
- Lead frames are one of the most important component parts of discrete and IC devices,with the development of IC to high density,miniaturization. 引线框架材料是电子工业中不可缺少的重要原材料之一,随着集成电路向高密度,小型化,多功能化发展,对引线框架材料提出了新的要求。
- The horse forged ahead the lead in the homestretch. 那匹马在最后阶段突然加速跑到前面。
- Shirley will try out for the lead in the play. 雪莉将参加该剧主角的选拔演出。
- An example of SIL selection for a process is given. 并结合一个具体实例，介绍了如何实现安全完整性水平选择的过程。
