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- Mono-crystal silicon wafer polishing workshop of Lili Electronics Inc. Of NFTZ 宁波保税区立立电子公司单晶硅硅片抛光车间
- silicon wafer polishing 硅片抛光
- When polish silicon wafer directly bond, there are avery thin transition field and a tiny lattice-error, but no more stress in drawn into. 当抛光硅片直接键合时;界面出现极薄的过渡区;并存在微小的晶向差;但不引起多余应力.
- Hot plate with silicon wafer lowered to heating position. 加热板与矽晶圆降低至加热位置。
- Mechanical Test Wafer - A silicon wafer used for testing purposes. 机械测试晶圆片-用于测试的晶圆片。
- Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污颗粒-晶圆片表面上的颗粒。
- Hot plate with silicon wafer in initial configuration (before heating). 加热板与矽晶圆在启始状态(加热前)。
- SiO2, an insulator, can be formed by oxidation of surface of the silicon wafer. 经净化的晶棒接著用机械方法切成薄片.;这些切片就叫做晶圆
- A New Method of Resistless Photochemical Etching for Silicon Wafer[J]. 引用该论文 杨杰;刘焰发;村原正隆.
- Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer. 沾污区域-部分晶圆片区域被颗粒沾污,造成不利特性影响。
- ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技术应用到集成电路制造中,就是将掩模版的几何图形转移到硅片表面的工艺过程。
- Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component. 芯片:单回路或元件的硅晶元,无引脚的电子元件。
- Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes. 测试晶圆片-用于生产中监测和测试的晶圆片。
- The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically. 对锯切硅片时各工艺参数对切片表面质量的影响规律进行了理论研究。
- A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. 采用硅微加工技术制作微管道,在玻璃上通过溅射方法形成钛铂合金热膜,最后将两者键合封装,形成埋置了热膜的封闭微管道。
- The silicon wafer is tacked with tiny pillars that catch abnormal cells that are, in the end, potentially cancerous. 硅片就好像微小的柱子那样把不正常的细胞钉住,而这些最终将成为潜在的癌细胞。
- This equipment is applied to stripping silicon wafer through heating water to certain temperature. 本设备是将水加热到一定温度,用于硅片脱胶的一款设备。
- The experiments show that CF4 treatment to silicon wafers can not only activate them but also polish their surfaces effectively,and it can improve the pre-bonding greatly. 实验表明,CF4对硅片的处理不仅可以激活表面,而且可以对硅片表面进行有效的抛光,大大加强了预键合的效果。
- A silicon wafer chip manufacturer tries to close a deal with a solvent service company. 矽晶片制造厂商努力与一个有偿付能力的服务公司谈成生意。
- The effect of nitrogen on oxygen precipitate profile in Czochralski (CZ) silicon wafer is investigated. 摘要研究了氮在退火过程中对直拉硅片中的氧沉淀分布的影响。