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- Generally, solder alloys with more than about 8% bismuth will be brittle. 一般来说,铋含量超过8%25的焊料合金将会变脆。
- Just as with the lead-based solder alloys, there are several alloys that seem to be the most commonly used. 就如同使用含铅焊料合金一样,同样也存在几种看来最为常用的合金。
- Is there a standard lead-free solder alloy? 是否存在一种标准无铅焊料合金?
- Kester continued to expand in 1998 by acquiring the IEM electronic solder paste product line from Fusion Incorporated and the assets of Cramco Solder Alloys Limited in Canada. 凯斯特公司通过收购Fusion股份有限公司的IEM电子焊锡膏产品系列和加拿大的Cramco焊料合金有限公司的资产,实力得到了不断扩充。
- From the outcome of research, there are several viable lead-free solder alloys that offer a set of balanced performance characteristics including the superior mechanical properties. 通过研究，有一些具有实际应用价值的无铅焊料合金，一方面具有优异的机械性能，另一方面又具有一系列均衡的材料特性。
- With more than 150 patents globally, selection of a lead-free solder alloy must be done carefully so proper license fees are paid for using patented alloys. 全球已有超过150个相关专利,因此,选择某种无铅焊料合金必须谨慎进行,使用专利合金要支付适当的特许费用。
- Soft solder alloys - Chemical compositions and forms 软钎焊合金。化学成份和形状
- Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system were carried out by means of Chou model. 利用周模型对Sn-Ag-Cu-Ce无铅钎料合金体系进行了热力学计算预测。
- The fatigue life of the solder alloy followed the Coffin-Manson equation, from which relevant fatigue parameters were determined. 线性回归分析表明;该焊料的低周疲劳寿命满足Coffin-Manson经验关系式;由此给出了焊料在室温下的低周疲劳参数.
- The fatigue behavior of the solder alloy was related to the fatigue-induced microstructural variations and the fracture mechanism. 采用扫描电镜观测和分析了焊料在疲劳前后的组织特征。
- Moreover,available methods of solder alloy design and tendency of test method turning to calculation method with predictable function in solder alloy design are also elaborated. 并对现有钎料设计方法以及钎料设计由试验向具有性能预测功能的计算设计方法的发展趋势加以叙述。
- The latter feature of a solder alloy is defined as the affinity and effectiveness of a molten metal to wet a substrate surface (such as Cu or Ni) under a given set of conditions. 焊料合金的润湿特性是指，在一定条件下，合金在融化状态下对基板界面（如：铜或镍）的润湿亲和力和润湿效率。
- Wetting Property of Surface Mount Componest for SnAgCu Solder Alloys SnAgCu系钎料合金对表面贴装元件润湿特性研究
- strontium-base substitute soldering alloys 代焊接合金
- Current Status of Lead-Free Solder Alloy 无铅钎料发展现状
- Lead as soldering alloy in high performance communication electronic board and hexavalent chromium (Cr-VI)). 用于高功率通讯电子板及六价铬中作为焊锡合金的铅。
- Alloys will not have the same properties as pure metal. 合金没有纯金属所具有的同样的性能。
- Sn-2.5Ag-0.7Cu(0.1 RE) solder alloy Sn-2.;5Ag-0
- Suit for reflow and wave flow solder. 适应再流焊与波峰焊。
- SMOBC: Solder mask over bare copper. 一种阻焊层覆盖裸铜的工艺。
