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- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- The RTS profile may be used with any chemistry or alloy, and is preferred for use with water soluble solder pastes and difficult-to-solder alloys and parts. RTS回流曲线可以适合任合锡膏和合金，特别适合于水溶性锡膏和比较难焊接的金属和元件。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- The use of nitrogen will depend on the solder paste flux chemistry. 是否使用氮气取决于焊锡膏焊剂的化学特性。
- Is the sequence of Solder Paste height measurements defined? 锡膏厚度的测量顺序是否指定?
- In the beginning, "I-HUA Trading Co., Ltd." was engaged in promoting SMT materials thru importing from Japanese Fuji Chemical SMD adhesives, Shikoku SMD adhesives and Nihon Superior solder pastes for local market. 初期，宜桦贸易有限公司以推广自日本进口之表面黏著技术所使用之接著剂及锡膏给国内厂家。
- Is the average and range of Solder Paste height measurements SPC controlled? 锡膏厚度测量的平均值和间距SPC是否受控?
- A well-designed lead-free solder paste will have excellent tack life and the stencil life will be similar to traditional leaded pastes. 良好设计的无铅焊锡膏会具有优异的粘着寿命,模板寿命也将与传统含铅焊锡膏类似。
- What are the main qualification tests for using lead-free solder paste? 使用无铅焊锡膏的主要评选测试有哪些?
- RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste. RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。
- The operator should use the solder paste quickly after it has been taken out. 取出的锡膏要尽快实施印刷使用。
- Are LCD's and UCLA's defined for the average and range of Solder Paste measurements? 对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?
- Is the upper and lower specification limits for individual Solder Paste height measurements also defined? 单点锡膏厚度测量是否定义了其控制上限和下限?
- To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads. 为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
- Do not touch solder paste bare-handed. Remove with ethyl alcohol from body or clothes if contaminated by solder paste. 小心使用焊膏,避免触及皮肤。若附于衣服或身体时,应尽快用含有酒精的溶剂把焊膏抹掉。
- TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable. TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
- Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester. Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。
- Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester. Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。
- Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched. 丝印模板,锡浆网,胶水网
