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- step model heat sinks 台阶式热沉
- How to select the suitable heat sink? 如何选择合适的散热片?
- We want to purchas heat sink ,please contact us. 求购温控器，请生产厂家联系我们。
- Very high heat sink capacity of the MEPCM was found by DSC method. 最后的dsc热分析表明了MEPCM具有很高的蓄热能力。
- Electronic parts: heat sink copper holder, fiber coupler body. 电子零件：散热器铜座，光纤连结器本体.
- Zhenjiang East Asian heat sink, the transistor, resistor. 镇江东亚散热片，二三极管，电阻。
- Silicon microchannel heat sinks for high-power laser diode arrays[J]. 引用该论文 YANG Tao;HE Ye;LIU Ting-ting.
- The paper analyzed and discussed two-dimensional heat sink in theory. 本文对二维的热沉问题进行了理论分析和讨论。
- A serial of models for field road location were also developed, which included a step model, a trapezium model, and a multi-trapezium model. 我们还提出一系列田间道路模型:带斜边的阶跃模型、梯形模型和多梯形模型。
- Because the graphite rods serve as heat sinks, they must be cooled before they are ready for their next cycle. 由于石墨棒充当散热器，所以它们在进入下一个循环周期前必须冷却下来。
- Capable of full system analysis , with multiple components such as heat sinks, fans, and openings allowed in a cabinet. 能够全面系统的分析，多部件，如散热器，风扇，及开口获准在内阁。
- This method can obtain step model by proceeding multistep measuring on condition that device working normally.Application result indicated that it is feasible and practical on engineering. 该方法可以在装置正常工作的条件下，进行多次阶跃测试，获得阶跃模型。
- Power densities that can be tolerated by a gage are strongly related to the specimen which serves as the heat sink. 应变片所能允许的电能密度与起着散热器作用的试件密切相关。
- The micro-channel cooling heat sinks provide a powerful means for dissipating high heat flux in microelectronic devices. 微槽冷却热沉是微电子器件中工作芯片冷却的一种有效措施。
- Computers usually require heat sinks, radiators, fans, heat pipes or even fluid-based heat pumps to extract the surplus degrees. 电脑通常必须使用散热器、冷却器、风扇、导热管，甚至液体热泵，来降低过高的温度。
- Meanwhile, the influence of triangular edge shape channel inlet on the air flow characteristics and heat transfer in heat sinks was researched as well. 研究了强制风冷中空气入口侧三角形肋片边缘形状对散热器换热性能和流动阻力的影响。
- Study of step model in event news'communication 事件新闻梯级传播模式研究
- With such a large heat sink value, FRA can meet the requirement of hypersonic flying machine. 在 80 0℃时 ,两者都具有较高的热沉值 ,分别达到 5 6 9MJ kg和 6 6 0MJ kg ,该热沉值能够满足超高音速飞行器的热管理要求。
- grey step model with error modifying(GSMEM) 残差修正步进模型
- Complex heat sink devices, including liquid cooled cold plates and stacked fins with heat pipes . 复杂的散热器产品，其中包括液体冷却的冷板块和堆叠鳍片与热管。
